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    <channel>        <title>As The Wafer Turns - All Photos</title>
        <description>Recent public photos on As The Wafer Turns</description>
        <link>http://ibmcommunity.ning.com</link>
        <pubDate>Fri, 18 Dec 2009 19:59:17 +0000</pubDate>
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            <title>As The Wafer Turns - All Photos</title>
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                        	<guid>1399161:Photo:1283</guid>             <title>ibm mayo_57</title>
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            by Catherine Helzerman A Meeting Over Minds
Date added: 09 Jan 2008
Dr. Bradley Erickson (sitting), head of Mayo’s Radiology Informatics Lab. and Bill Rapp, distinguished engineer and chief technology officer of IBM&#039;s Healthcare and Life Sciences team, scan brain images in the new Medical Imaging Informatics Innovation Center on the Mayo campus in Rochester, MN. The Center is a collaborative endeavor by Mayo and IBM, providing the medical community a research facility aimed at advancing imaging technologies to improve the quality of patient care.</description>
                <pubDate>Wed, 09 Jan 2008 17:34:44 +0000</pubDate>
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            	            <media:description>A Meeting Over Minds
Date added: 09 Jan 2008
Dr. Bradley Erickson (sitting), head of Mayo’s Radiology Informatics Lab. and Bill Rapp, distinguished engineer and chief technology officer of IBM&#039;s Healthcare and Life Sciences team, scan brain images in the new Medical Imaging Informatics Innovation Center on the Mayo campus in Rochester, MN. The Center is a collaborative endeavor by Mayo and IBM, providing the medical community a research facility aimed at advancing imaging technologies to improve the quality of patient care.</media:description>
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	            <media:keywords></media:keywords>
	            <media:credit role="photographer">Catherine Helzerman</media:credit>
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                        	<guid>1399161:Photo:790</guid>             <title>It&#039;s raining in Hamburg.</title>
            <link>http://ibmcommunity.ning.com/photo/1399161:Photo:790</link>
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            by Bas Zapf View from floor 11, IBM Office Hamburg, Germany.</description>
                <pubDate>Wed, 07 Nov 2007 09:02:40 +0000</pubDate>
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            	            <media:description>View from floor 11, IBM Office Hamburg, Germany.</media:description>
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	            <media:keywords></media:keywords>
	            <media:credit role="photographer">Bas Zapf</media:credit>
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                        	<guid>1399161:Photo:761</guid>             <title>Fresh picture, sent with my cell phone</title>
            <link>http://ibmcommunity.ning.com/photo/1399161:Photo:761</link>
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            by Bas Zapf Testing 1 2 3, hello world, hello IBM.</description>
                <pubDate>Tue, 06 Nov 2007 23:24:24 +0000</pubDate>
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            	            <media:description>Testing 1 2 3, hello world, hello IBM.</media:description>
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	            <media:keywords></media:keywords>
	            <media:credit role="photographer">Bas Zapf</media:credit>
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                        	<guid>1399161:Photo:506</guid>             <title>ThiloDotzel2</title>
            <link>http://ibmcommunity.ning.com/photo/1399161:Photo:506</link>
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            by Thilo Dotzel </description>
                <pubDate>Tue, 06 Nov 2007 06:21:00 +0000</pubDate>
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            	            <media:description></media:description>
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	            <media:credit role="photographer">Thilo Dotzel</media:credit>
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                        	<guid>1399161:Photo:390</guid>             <title>POWER6 wafer</title>
            <link>http://ibmcommunity.ning.com/photo/1399161:Photo:390</link>
                            <description>&lt;a href=&quot;http://api.ning.com/files/G4Fka7IdLyZbl1z1BqZJ4CFAbu8jdQWaEr*NcndiLQk_/POWER6wafer.jpg?width=253&amp;amp;height=263&amp;amp;format=jpg&quot;&gt;&lt;img src=&quot;http://api.ning.com/files/G4Fka7IdLyZbl1z1BqZJ4CFAbu8jdQWaEr*NcndiLQk_/POWER6wafer.jpg?width=230&amp;height=240&amp;format=jpg&quot;&gt;&lt;/a&gt;
                
            by Jeff Gluck A wafer full of the most advanced microprocessors in the world, IBM&#039;s POWER6</description>
                <pubDate>Mon, 05 Nov 2007 22:15:00 +0000</pubDate>
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            	            <media:description>A wafer full of the most advanced microprocessors in the world, IBM&#039;s POWER6</media:description>
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	            <media:keywords></media:keywords>
	            <media:credit role="photographer">Jeff Gluck</media:credit>
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                        	<guid>1399161:Photo:62</guid>             <title>IBM Waste to Energy</title>
            <link>http://ibmcommunity.ning.com/photo/1399161:Photo:62</link>
                            <description>&lt;a href=&quot;http://api.ning.com/files/O8krJiLkINc9bSw9aMkW7j230r6FptkZs0u1eRQrPIs_/ibmbtvsolar1b.jpg?width=547&amp;amp;height=600&quot;&gt;&lt;img src=&quot;http://api.ning.com/files/O8krJiLkINc9bSw9aMkW7j230r6FptkZs0u1eRQrPIs_/ibmbtvsolar1b.jpg?width=219&amp;height=240&quot;&gt;&lt;/a&gt;
                
            by Catherine Helzerman Shortage of silicon constrains growth of solar panel industry: IBM has developed a process for repurposing scrap silicon wafers from its chip manufacturing operations for use in energy-producing solar panels. In this photo Michelle Bolz, an IBM manufacturing engineer, holds a solar panel above a crate of scrap silicon wafers ready to be recycled. IBM intends to provide details of the new process to the broader semiconductor manufacturing industry</description>
                <pubDate>Wed, 31 Oct 2007 22:15:59 +0000</pubDate>
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            	            <media:description>Shortage of silicon constrains growth of solar panel industry: IBM has developed a process for repurposing scrap silicon wafers from its chip manufacturing operations for use in energy-producing solar panels. In this photo Michelle Bolz, an IBM manufacturing engineer, holds a solar panel above a crate of scrap silicon wafers ready to be recycled. IBM intends to provide details of the new process to the broader semiconductor manufacturing industry</media:description>
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	            <media:keywords></media:keywords>
	            <media:credit role="photographer">Catherine Helzerman</media:credit>
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